De Machine van de elektronikaröntgenstraal
EMS BGA 90kV 5um NDT X Ray Equipment FPD voor de Schakelaar van de Uitrustingskabel
90kV Sealed Tube 5μm Micro Focus Wire Harness Cable Internal Defect Xray Inspection Machine AX7900 Unicomp Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
CSP-Elektronika X Ray Machine UNICOMP CX3000 voor Kabelschakelaar
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
CSP-LEIDENE 5um X Ray Inspection Machine Microfocus AX8200 met CNC Afbeelding
Unicomp 5um Microfocus AX8200 X Ray Inspection Machine For Automotive Electronics quality control with CNC mapping Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB
Elektronika X de Detector Unicomp van EMS SMT van Ray Machine 90kV FPD
EMS SMT Electronics X Ray Machine 90kV FPD Detector Unicomp Original manufacturer SMT Equipment Electronics X Ray Machine on IC chips wire Analysis Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging
22“ Elektronika X van Unicomp AX8200B Ray Machine For Polymer Lithium-Batterij
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes
130KV industriële röntgeninspectiemachine voor detectie van BGA, PCBA en soldeerlekkage AX9100MAX UNICOMP
130KV Industrial X-ray Inspection Machine for BGA, PCBA and Solder Voiding Detection AX9100MAX UNICOMP This system sees extensive deployment across diverse inspection scenarios including BGA, CSP, flip chip, LED, fuses, diodes, PCBs, discrete semiconductors, lithium batteries, miniature metal castings, electronic connector assemblies, wiring harnesses, photovoltaic components, and other microelectronic products. Functions and Feature Inspection Image System Summary Footprint
High Motion Precision 5μm Micro Focus BGA QFN Elektronische röntgenapparatuur AX7900 Unicomp Kwaliteitscontrole
High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900 Automatic X-ray Mapping Inspection for IC Electronics Components Advanced X-ray inspection system for internal quality assessment and counterfeit detection of electronic components. System Overview The AX7900 features a 90KV 5μm X-ray tube with FPD detector, multi-function workstation, and comprehensive motion control system. The system includes XY multi-axis movement with ±60° tilt motion option
Unicomp AX8300H Röntgendetectie Machine met 110kV Microfocus Röntgenbron en Hoge Resolutie FPD
AX8300H röntgeninspectie met 110 kV microfocusbron en 360° rotatie. FPD-detectie met hoge resolutie voor BGA-, CSP- en halfgeleideranalyse. Voldoet aan de FDA-veiligheidsnormen met lekkage van <1μSv/u.
Unicomp X-ray AX8300MAX Semiconductor Microfocus röntgeninspectieapparatuur
Unicomp X-ray AX8300MAX Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel 6.