electronics x ray system
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Condensator Interne Tekorten X Elektronisch Ray Inspection Equipment Micro Focus
Micro Focus Electronics X Ray System For Capacitor Internal Defects Control Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features Fingerprint Access Management System Real-time Monitoring of Radiation 24’’ FHD Interactive Touch LCD Display Large Size Inspection Table Laser Locator for
AC 110-220V de Macht van de het Onderzoeksmachine 0.8kW van het Röntgenstraalgebrek voor Voertuig LEIDENE Verlichting
Electronics X Ray Machine for BGA , CSP , LED , Flip Chip , Semiconductor OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support you. 6
NDT Unicomp X Ray Systems unc160-c-l X Ray Testing Of Castings 160KV
NDT Unicomp X-Ray Systems UNC160-C-L Die Castings Pipe Inspection Features: * The implementation of automatic location detection * Automatic identification of defect detection * The unqualified product identification marking * OK and NG are sorting and recognition * High contrast, high quality image detection * Extended-modular design, strong, automatic loading and unloading * Adopt the design of transmission mechanism of high speed positioning, multi axis motion detection
Kneedbaar Ijzer NDT X Ray Equipment Low Breakdown UNC450 voor Aluminiumafgietsel
UNC450 Ductile Iron NDT Real Time Imaging Unicomp X-ray Inspection Machine Features: ● High reliable and long life,low breakdown; ● High definition and resolution FPD; ● C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend); ● Multi-functional workstation,360°rotation and shift; ● User friendly software design for easy interfacing can facilitate,customized software ; ● High penetration,Voltage up to 450KV,Maximum penetration thickness
100kV PCBA X Ray Inspection System Unicomp Electronics voor de Leegte/het Solderen van BGA
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector Intensifier 4”/2” (FPD Optional) Resolution 77/110 LP/cm Camera 200 Mega Pixel CCD Motion range (Up and Down) 290mm System Operating System Industrial PC, Win 7, i7
Het LEIDENE Strook Solderen van het het Systeem Nietige Gebrek van de Elektronikaröntgenstraal de Opsporingscnc Controlewijze
LED Strip Soldering Quality / Void Flaw Detection X-Ray Machine Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Elektronica röntgeninspectiemachine AX7900 Unicomp 5µm Micro Focus Automatische Leegte Detectie BGA Soldeer Hoge Precisie
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
BGA-Materiaal 22 van de Inspectieröntgenstraal“ LCD met CNC Programmeerbare Opsporingsfunctie
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient
Unicomp AX9100max Röntgenmachine 130kV 65W VAN BGA
Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp AX9100max X-ray Machine Functions and Features Functions and features of Unicomp AX9100max X-ray
