industrial inspection systems
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Elektronika BGA X Ray Inspection System Auto Measuring van het condensator de Binnentekort
Capacitor Inner Defect Inspection with Electronics X-ray 100 KV Power AX8200MAX Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic
FPD Verzegelde 100KV-Condensatorpcb X Programmeerbaar Ray Inspection CNC
FPD 100KV X Ray Inspection System For Capacitor Function & Features Large Size Inspection Table Laser Locator for Precise Location 24’’ FHD Interactive Touch LCD Display Accurate Control, CNC ProgrammingAutomatic Positioning FPD 60° Tilting Inspection Fingerprint Access Management System Real-time Monitoring of Radiation Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic
Unicomp AX8200MAX X Ray Inspection Equipment For Semiconductor
Unicomp AX8200 X Ray Inspection Equipment For Semiconductor Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable)
Elektronika X van PCB van EMS SMT LEIDENE van Ray Machine BGA QFN Solderend Nietig NDT Inspectiemateriaal
Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Application Fields of X Ray Machine AX8200Max SMT/PCBA Inspection Semiconductor Inspection Lithium Batteries Inspection LED Inspection Photovoltaic
Unicomp AX8200max röntgeninspectiemachine voor inspectie van kabelboomdefecten
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Technical Specifications of BGA Xray machine AX8200max System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC
Röntgeninspectiesysteem voor de controle van de conditie van kleine verpakkingen van levensmiddelen
X-Ray Inspection System for Small Packed Food Packing Condition Inspection Product Description: Our state-of-the-art X-Ray foreign object detection equipment revolutionizes safety standards in the small packaged food, pharmaceutical, and health supplement sectors. By providing pinpoint accuracy in detecting even the smallest impurities, it guarantees purity and compliance with rigorous quality control measures. Ideal for manufacturers seeking to protect consumer health,
Röntgeninspectiesysteem voor het detecteren van zuurstofabsorptoren voor kleine verpakte levensmiddelen met een capaciteit van 5 kg
X-Ray Inspection System for Small Packed Food Missing or Extra Oxygen Absorber Detection Product Description: Our innovative X-Ray technology for foreign object detection redefines safety benchmarks across small packaged food, pharmaceutical, and health supplement industries. With unparalleled precision, it identifies even minute contaminants, ensuring impeccable purity and compliance with stringent quality assurance protocols. Tailored for manufacturers committed to
Geavanceerd röntgeninspectiesysteem voor het detecteren van ongewenste voorwerpen
X-Ray Inspection System for Unwanted Object Detection Product Description: Our cutting-edge X-ray contaminant detection technology, tailored for packaged foods, has revolutionized quality assurance protocols across a broad spectrum of products, including instant meals, frozen items, fresh-cut fruits and vegetables, as well as snack foods. By effortlessly penetrating packaging materials, it swiftly identifies any undesirable contaminants, thereby enhancing food safety
10-40m/min Röntgeninspectiesysteem voor het detecteren van vreemde stoffen in salami/worst
X-Ray Inspection System for Foreign Material Detection in Salami/Sausage Product Description: Our pioneering X-ray inspection system for bagged food products has revolutionized the quality control landscape, encompassing a wide array of edibles from instant meals to chilled goods, fresh produce slices, and on-the-go snacks. By seamlessly traversing through packaging layers, it promptly pinpoints any foreign matter, bolstering food safety measures and compliance with stringent
