x ray detection equipment
"
De vierlingspoel van de Unicompsmd Chip Counter Röntgenstraal en JEDEC-dienblad met dynamische AI algoritme en Wolkensteun
Unicomp SMD Chip Counter X Ray quad reel and JEDEC tray with dynamic AI algorithm and Cloud support Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System
DR. Röntgenstraalndt systeem van de multi-manipulator225kv Radiografie voor autopartsaluminium het gieten kwaliteit het controleren
Multi-manipulator 225KV Radiography DR X-ray NDT system for autoparts aluminum casting quality checking UNC225 is a robust, reliable industrial X-ray inspection system for broad applications in foundries, R&D, laboratories, universities, and educational institutions. The system delivers brilliant image quality with digital flat-panel detector and highly dynamic radioscopy. Smart ergonomics for easy operation Tailor-made configuration for wheels and tires Renowned, robust,
Van de de Inspectiemachine DXI van de tribune het Alleen Nietige BGA Röntgenstraal van de het Beeldverwerking Systeem 40W
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system,
AC 110~220V Bga de Resolutiefpd Detector van het Inspectiemateriaal hallo voor Industrieel SMT
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
Het Afgietsel van de aluminiummatrijs SMT/EMS-CNC van de Röntgenstraalmachine Programmeerbare Opsporing voor BGA-Leegten
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
2.5D van de de Röntgenstraalmachine 40W van de titelopdrukelektronika de Omwenteling 360° met 6 Asbeweging
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point positioning system 130kV (Option 110KV) 7µm closed X-ray tube,
Inspectie X Ray Chip Counter 440mm van SMT BGA Tunnelce
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Inventaris die de Elektronikacomponenten tellen van X Ray Chip Counter Flip Chip For
High precision SMD X-Ray chip counter Unicomp CX7000L for electronics components inventory counting Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast
Elektronika X van SMT PCBA de Tunnel van Ray Chip Counter Unicomp CX7000L 440mm
Factory directly supply of SMD Xray Chip counter Unicomp CX7000L for SMT and PCBA electronics compamy Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System