x ray inspection equipment
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BGA-de Machine van de Röntgenstraalinspectie, PCB-het Systeem Tellende Apparaten van de Röntgenstraalinspectie
BGA X-Ray Inspection Machine high-quality PCB inspection system counting devices This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the
BGA-het Systeem van de Röntgenstraalinspectie, van de de Inspectiemachine van Röntgenstraalpcb Hogere de Testdekking
SMT , BGA , CSP , Flip Chip , LED BGA X Ray Inspection Machine Unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage
IHDR-algoritme Verbeterde BGA- en PCBA-röntgeninspectie UNICOMP AX8300 Ultraheldere defectvisualisatie
IHDR Algorithm Enhanced BGA & PCBA X-ray Inspection UNICOMP AX8300 Ultra-Clear Defect Visualization The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In Between” design that offers a solution when 90kV is not enough energy and 130kV is too much.Using a state of the art FPD (Flat Panel Display) detection, the AX-8300 can
De Inspectiemachine van de elektronische Componentenbga Röntgenstraal
Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids,
De Inspectiemachine van de Unicompax8300 BGA Röntgenstraal met de Lage Tijd van de Testvoorbereiding
BGA X Ray Inspection Machine with high quality X ray images Unicomp AX8300 X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Model AX8300 Max kV/type 110 kV(Option90 kV)/Sealed Max.Electron beam power
De Röntgenstraalmachine van de hoge Prestatieselektronika, BGA-Type van Inspectie het Materiaal Gesloten Buis
Electronic and electrical components BGA X Ray Inspection Machine Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60° X-Ray System Tube Type Closed Voltage/Current 100kv/200μA Focal Spot Size 5μm FPD Detector FPD Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm Weight 1500 kg Power 2kW System Magnification 500 x
De hoge Efficiënte BGA-Machine van de Röntgenstraalinspectie, van de Micro- het Kabinetssystemen Nadrukröntgenstraal
Micro-focus x-ray cabinet systems BGA X-Ray Inspection Machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
Uiterst nauwkeurige 2,5D/3D röntgeninspectie voor BGA- en PCBA-defectdetectie UNICOMP AX8300
High-Precision 2.5D/3D X-ray Inspection for BGA & PCBA Defect Detection UNICOMP AX8300 The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In Between” design that offers a solution when 90kV is not enough energy and 130kV is too much.Using a state of the art FPD (Flat Panel Display) detection, the AX-8300 can generate extreme
10 kW NDT X Ray Equipment For Casting Defects Heatsinks/Hete Scheuren/Koude Stroom
Casting defects heat sinks, hot tears, cold-flow, drag-marks, missing material and cracks NDT X-Ray Inspection Application Fields of X Ray Machine UNZ-450 ● Engineering components ● Small aluminum castings, iron castings ● Auto parts, metal products Technical Parameters and Specifications of X Ray Machine UNZ-450 System Parameters Dimensions 2766mm*2813mm*2598mm(L*W*H) Equipment weight 17.5T Power 10 kW Maximum penetration (FE) 80 mm Detection range Φ550*200mm Load weight
