Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...

BGA Void Bridging Missing Ball Detection X-ray AX8300 UNICOMP Real-Time Safety Monitoring The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...

Unicomp UNX4015 X-ray Inspection System The Unicomp UNX4015 automatic X-ray inspection system provides reliable detection of missing filling and package integrity issues in toothpaste boxes, along with foreign object detection capabilities for various packaged goods. System Overview High-precision X...

AX9100MAX X-ray Inspection Equipment High-accuracy nondestructive detection system for analyzing electronic IC parts, bonding wires, and solder joint hidden damage in LED drivers and electronic components. System Overview This advanced X-ray inspection equipment performs precise nondestructive ...