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5μm Minimum Resolution CNC Electronic BGA Package AX8300MAX Unicomp Missing Solder Ball QC Detector

Basis eigenschappen
Plaats van herkomst: China
Merknaam: UNICOMP
Certificering: CE, FDA
Modelnummer: AX8300MAX
Handelsgoederen
Minimale bestelhoeveelheid: 1set
Prijs: can negotiate
Betalingsvoorwaarden: T/T,L/C
Leveringscapaciteit: 30 sets per maand
Productoverzicht
AX8300MAX Unicomp Missing Solder Ball QC Detector This advanced industrial X-ray inspection system delivers 5μm minimum resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection ...

Productdetails

Markeren:

5μm resolution BGA detector

,

CNC electronic BGA package

,

missing solder ball QC detector

Model: AX8300MAX
Motion Control Mode: Muis & toetsenbord & joystick
Tilt And Rotation: Detector eenzijdig kantelbaar maximaal 60°
Monitor: 27-inch HD 4K-scherm
System OS: Windows11 64-bits
Power Consumption: 900W
Tube Type: Verzegeld
Productbeschrijving
AX8300MAX Unicomp Missing Solder Ball QC Detector This advanced industrial X-ray inspection system delivers 5μm minimum resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of: Semiconductor packaging devices including BGA, CSP, LED and flip chip Automotive electronic components New energy core
Algemene Beoordeling
5.0
★★★★★
★★★★★
Gebaseerd op 50 recente beoordelingen
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Alle recensies
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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