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Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester

Basis eigenschappen
Plaats van herkomst: China
Merknaam: UNICOMP
Certificering: CE, FDA
Modelnummer: AX9500
Handelsgoederen
Minimale bestelhoeveelheid: 1set
Prijs: can negotiate
Betalingsvoorwaarden: T/T,L/C
Leveringscapaciteit: 300 sets per maand
Productoverzicht
Multi-mode 3D Reconstruction PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Inspection Tester High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Product Overview Fully upgraded new products featuring advanced CT detection ...

Productdetails

Markeren:

Multi-mode 3D X-ray inspection machine

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BGA solder joint X-ray tester

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PCBA X-ray inspection machine with warranty

Name: De Inspectiemachine van de Unicompröntgenstraal
Application: SMT, EMS, BGA, Elektronika, CSP, leiden, Flip Chip, Halfgeleider
Industry: Elektronische industrie
X-Ray Leakage: < 1uSv="">
Productbeschrijving
Multi-mode 3D Reconstruction PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Inspection Tester High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Product Overview Fully upgraded new products featuring advanced CT detection capabilities for BGA, CSP, flip chips, LEDs and other semiconductors. Ideal for SMT welding analysis with comprehensive 3D tomography CT scanning system (planar CT + cone beam CT).
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