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110KV X-ray Inspection for BGA with AI-Powered Automatic Void Detection Unicomp AX8300MAX

Basis eigenschappen
Plaats van herkomst: China
Merknaam: UNICOMP
Certificering: CE, FDA
Modelnummer: AX8300MAX
Handelsgoederen
Minimale bestelhoeveelheid: 1set
Prijs: can negotiate
Betalingsvoorwaarden: T/T,L/C
Leveringscapaciteit: 30 sets per maand
Productoverzicht
UNICOMP AX8300MAX X-ray Inspection System Advanced 110KV industrial X-ray inspection system with AI-powered automatic void detection, specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...

Productdetails

Markeren:

110KV X-ray BGA inspection machine

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AI-powered automatic void detection X-ray

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Unicomp AX8300MAX X-ray electronics

Model: AX8300MAX
Motion Control Mode: Muis & toetsenbord & joystick
Tilt And Rotation: Detector eenzijdig kantelbaar maximaal 60°
Monitor: 27-inch HD 4K-scherm
System OS: Windows11 64-bits
Power Consumption: 900W
Tube Type: Verzegeld
Productbeschrijving
UNICOMP AX8300MAX X-ray Inspection System Advanced 110KV industrial X-ray inspection system with AI-powered automatic void detection, specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic
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