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Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection

Basis eigenschappen
Plaats van herkomst: China
Merknaam: UNICOMP
Certificering: CE, FDA
Modelnummer: AX8300MAX
Handelsgoederen
Minimale bestelhoeveelheid: 1set
Prijs: can negotiate
Betalingsvoorwaarden: T/T,L/C
Leveringscapaciteit: 30 sets per maand
Productoverzicht
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable ...

Productdetails

Markeren:

Unicomp AX8300MAX X-ray inspection machine

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BGA automated void detection X-ray

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110KV X-ray machine for electronics

Motion Control Mode: Muis & toetsenbord & joystick
Tilt And Rotation: Detector eenzijdig kantelbaar maximaal 60°
Monitor: 27-inch HD 4K-scherm
System OS: Windows11 64-bits
Power Consumption: 900W
Productbeschrijving
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and
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