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De Machine van de elektronikaröntgenstraal

Kwaliteit Unicompax8200 Elektronika X Ray Machine Closed Tube Cable-Uitrustingsschakelaars Fabriek

Unicompax8200 Elektronika X Ray Machine Closed Tube Cable-Uitrustingsschakelaars

Cable Harness Connectors Quality Inspection by Unicomp AX8200 Microfocs X-ray with high resolution FPD Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is ...
Kwaliteit Halfgeleider110kv Elektronika X Ray Machine 5um AX8500 voor PCBA BGA Fabriek

Halfgeleider110kv Elektronika X Ray Machine 5um AX8500 voor PCBA BGA

110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing ...
Kwaliteit Elektronika X Ray Machine 110kV Unicomp AX8500 van CSP SMT voor SMT PCBA BGA QFN Fabriek

Elektronika X Ray Machine 110kV Unicomp AX8500 van CSP SMT voor SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight ...
Kwaliteit 5um SMT X Ray Equipment CNC Programmeerbaar voor de Leegten van EMS BGA Fabriek

5um SMT X Ray Equipment CNC Programmeerbaar voor de Leegten van EMS BGA

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing ...
Kwaliteit Algoritmefpd Elektronika X Ray Machine 1.0kW voor LEIDEN Terugvloeiingssoldeersel Fabriek

Algoritmefpd Elektronika X Ray Machine 1.0kW voor LEIDEN Terugvloeiingssoldeersel

Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables...
Kwaliteit CNC Programmeerbare 1,0 kW X PoP Pakket van Ray Machine For SMT BGA QFP Fabriek

CNC Programmeerbare 1,0 kW X PoP Pakket van Ray Machine For SMT BGA QFP

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” ...
Kwaliteit Ingekapselde Elektronika X Ray Machine 5μm van de Componentenweerstand Vlekgrootte Fabriek

Ingekapselde Elektronika X Ray Machine 5μm van de Componentenweerstand Vlekgrootte

Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical ...
Kwaliteit de Röntgenstraalmachine Unicomp AX8500 van 2.5D 110kv voor de kwaliteit die van Semicon leadframe met autometing controleren Fabriek

de Röntgenstraalmachine Unicomp AX8500 van 2.5D 110kv voor de kwaliteit die van Semicon leadframe met autometing controleren

2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm ...
Kwaliteit 5μm Microfocus Röntgenstraal met het overhellen 55° van FPD mening om LEIDENE van PCBA te inspecteren BGA QFN het solderen leegte Fabriek

5μm Microfocus Röntgenstraal met het overhellen 55° van FPD mening om LEIDENE van PCBA te inspecteren BGA QFN het solderen leegte

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight ...