De Machine van de elektronikaröntgenstraal
Ingekapselde Elektronika X Ray Machine 5μm van de Componentenweerstand Vlekgrootte
Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components EMS Semiconductor Electronics X Ray Machine System for BGA and CSP
de Röntgenstraalmachine Unicomp AX8500 van 2.5D 110kv voor de kwaliteit die van Semicon leadframe met autometing controleren
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
5μm Microfocus Röntgenstraal met het overhellen 55° van FPD mening om LEIDENE van PCBA te inspecteren BGA QFN het solderen leegte
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Unicompax8500 110kV 5um 2.5D Röntgenstraal voor Elektronika SMT die PCBA BGA IC kwaliteitscontrole solderen
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Het toepassen van 5μm dichte buisröntgenstraal om Wearable de knoopcel van het Elektronika navulbare Lithium te inspecteren
Applying 5μm close tube X-ray to inspect Wearable Electronics rechargeable Lithium button cell Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
99.8% Acurracy-de Teller van de de Machinespaander van het Röntgenstraalaftasten uploadt aan MES-ERP Systeem
Unicomp online X-Ray Chip Counter System, Counting Result Automatic upload to MES ERP System Spcifications: Max.Voltage 100kV Max.Current 3.5mA Spot Size 0.4mm Working Method Automatic inline inspection Imaging system Line scan camera Scanning accuracy >99.8% Scanning size 450 X 80 mm Minimum material size 01005 Display 22'LCD Display Max. inspection speed 0.1m/s Inspection size Φ30-Φ450mm less than 50mm thickness tray Scan height 10mm-60mm Dimensions 5500mm X 1000mm X 2100
De Röntgenstraalmateriaal 220AC/50Hz van kabinetsunicomp met DXI-het Systeem van de Beeldverwerking
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Het hoogst Flexibele Materiaal van het Röntgenstraalonderzoek voor Elektronika en Halfgeleider
Highly flexible and cost effective electronics and semiconductor X Ray Machine X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X-ray Inspecting Features: (1) Coverage of process defects up to 97%.
EMS-het Systeem van de de Röntgenstraalmachine van de Halfgeleiderelektronika voor de inspectie van BGA en CSP-
EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
