electronic inspection equipment
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De Machine van de de Elektronikaröntgenstraal van CX3000 Benchtop voor BGA, CSP, leiden & Halfgeleider
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor X ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X ray Inspecting Features: (1) Coverage of process defects up to 97%.
Grote de Röntgenstraalmachine van PCB van Inspectiestadia, het Materiaalsuper sensitive van de Röntgenstraalinspectie
Large inspection stages PCB X Ray Machine with high quality X-ray images Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, Other Special Industries. Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV/100kV Max.Power 8W Spot Size 5μm X-ray
De Röntgenstraalmachine van de hoge Prestatieselektronika, BGA-Type van Inspectie het Materiaal Gesloten Buis
Electronic and electrical components BGA X Ray Inspection Machine Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60° X-Ray System Tube Type Closed Voltage/Current 100kv/200μA Focal Spot Size 5μm FPD Detector FPD Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm Weight 1500 kg Power 2kW System Magnification 500 x
22“ LCD het Solderen van Monitorsmt EMS het Materiaal Hoge Resolutie van de Tekorten Elektronische Inspectie
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,
CSP-HOOFD X Ray Inspection Equipment 100kV Unicomp 5μm voor Elektrische Kabeluitrusting
Unicomp Factory Manufacturing 5μm microfocus X-ray Machine for Electric Cable harness quality inspection OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales
Elektronika X Ray Scanner Machine Inline Equipment-Productielijn
Electronics X-ray Machine Inline Equipment Production Line in Asia High resolution x-ray images are generated using a closed microfocus 130kV tube with leading edge FPD (Flat Panel Display) detectors. This imaging chain combination is excellent for multiple applications including; PCBA, Semiconductor, Encapsulated Components, and Solar Cell just to name a few. Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power
Het Materiaal van de de Röntgenstraalinspectie van hoge Machtspcb
Online inspection system PCB X Ray Machine with high power x-ray sources Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Unicomp AX8200MAX X Ray Inspection Equipment For Semiconductor
Unicomp AX8200 X Ray Inspection Equipment For Semiconductor Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable)
5 μm scherppuntgrootte verzegelde buis röntgeninspectieapparatuur voor kabel
X-Ray Inspection Equipment for Cable Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1220(D)×1615(H)mm Machine Weight 1250 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1250 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm Effective Detection Area 129*129mm Frame Rates 30fps
