electronics x ray system
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Elektronika X van PCB van EMS SMT LEIDENE van Ray Machine BGA QFN Solderend Nietig NDT Inspectiemateriaal
Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, ...
2.5D van de de Röntgenstraalmachine 40W van de titelopdrukelektronika de Omwenteling 360° met 6 Asbeweging
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation ...
Van de micro- van het de Röntgenstraalsysteem Nadrukelektronika Controle van de Elektronika de Interne Tekorten van SMT
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area ...
Algoritmefpd Elektronika X Ray Machine 1.0kW voor LEIDEN Terugvloeiingssoldeersel
Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables...
Automatische CNC-inspectie programmabel Elektronische röntgenmachine AX9100MAX met kantelhoek 60° voor IC-buigmaat
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
Hoog de Röntgenstraalsysteem van de Vergrotingselektronika voor de Nietige Inspectie van BGA CSP/QFN/PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area ...
CNC Programmeerbare van de de Röntgenstraalmachine van de Opsporingselektronika de Golfbal Binnenkwaliteitscontrole
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high ...
Multi - van de de Röntgenstraalmachine van de Functieelektronika de Hoge snelheidsrealtime voor Gouden Bal
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
Van de de Inspectieelektronika van PCB BGA de Golfbal van de de Röntgenstraalmachine binnen Kwaliteit het Controleren
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area ...
