industrial x ray systems
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Inline Unicomp LX9200 röntgeninspectiesysteem Hoge precisie voor PCB-/BGA-analyse
Inline High-Precision 3D X-Ray Tomography for PCB and BGA Analysis Unicomp LX9200 X-Ray inspection system Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge... Semiconduc
Autoonderdelen Hoogprecisie-röntgeninspectie-machine met robothandhaving voor lithiumbatterijbehuising
UNC160 Automotive Parts X-ray Inspection Equipment Aviation Automation Applications: ● Cast parts and pressure Vessels ● Epoxy Resin Defect Detection ● Wheel,Tires and Metal parts ● Steel pipe,Cylinder and Wood System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five wire system AC380V X-ray leakage dose
Geavanceerde UNL-serie NDT-röntgenmachine voor bandeninspectie
UNL Series NDT X-RAY Machine For Tire Inspection(DR) Product Description: UNL type X-ray intelligent testing equipment is a special testing equipment for automobile tires independently developed by Unicomp. Mainly used in automobile tire defect detection (tire internal foreign objects, parts do not meet requirements (missing or more), Radial cords(including open splices), cord fold, distortion, splices overlap,layer difference beyond standard,blisters or separation, radial
Röntgeninspectiesysteem voor vreemde stoffen in thee met mens-machine-interface
X-Ray Inspection System For Foreign Materials In Tea Technical Parameters: Product Name: X-Ray Inspection System For Foreign Materials In Tea Dimensions: 2530mm*1085mm*2075mm(L*W*H) Machine Weight: 600kg Radiation safety ≦1μSv/h Maximum load-bearing 10KG Form of the inspected item Pouch packaging Training: Yes, we warmly welcome you to visit our factory, we will arrange the free training for you. Services: Help customers analyze product projects and provide detection
Unicomp UNC160 NDT-röntgeninspectieapparatuur voor autocomponenten
Unicomp UNC160 NDT X-Ray Inspection Equipment For Car Components Product Description Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Broad Application Scope: Supports large-scale inspections with high load-bearing capacity. Safety Compliance: Adheres to
110KV Hoge-resolutie X-ray Unicomp AX8300 voor Niet-destructieve BGA Soldeerverbinding Analyse
High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2μm resolution. It supports 60° tilting & 360° rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips and solder joints. Our Service Commitment Response to inquiries within 12 hours Direct manufacturer pricing with competitive rates Comprehensive one-year warranty with free
160KV Microfocus röntgeninspectiemachine voor halfgeleiderdraadverlijming NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a maximum geometric magnification of 2000× with superior X-ray penetrability, this system enables precise void fraction quantification for TVS diodes and serves as a high-accuracy
Gealigneerde Röntgenstraalopsporing het Automatisch controleren Halfgeleider Elektronische Componenten
Inline X-ray Detection Equipment Checking Semiconductor Electronic Components Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University
BGA Void Soldeerverbindinginspectie UNICOMP AX8300 röntgensysteem voor PCBA-productiekwaliteitsborging
SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Major applications: PCBA BGA/IC LED Aliminum die casting Battery connector inspecting 1. Semiconductor package 2. Electronic connector module. 3
