logo
Welkom bij Unicomp Technology
+86-13502802495
Gevonden 887 producten voor "

industrial x ray systems

"
Kwaliteit De Opsporing Unicomp X van SMT EMS Detector van de de Inspectie de Lineaire Serie van Ray Machine PCBA BGA Fabriek

De Opsporing Unicomp X van SMT EMS Detector van de de Inspectie de Lineaire Serie van Ray Machine PCBA BGA

High Resolution Digital SMT EMS Detection X Ray Machine PCBA / BGA Inspection Linear Array Detector Specifications Operation System Windows Operation System 22" LCD Monitor Keyboard and Mouse X-Ray Machine Dimensions:1080(W)X1180(D)X1730(H) Packing Size:1420*1420*2000mm Weight: 1150KG Magnification:600X Power Requirements:220VAC 50Hz Temperature/Humidity:0℃~ 40℃ / 30 ~ 70RH Power Consuption(Max):0.5KW X-Ray Tube Voltage : 100KV Max Current: 200 μA Focal Spot Size: 5 micron

Kwaliteit Van de de Elektronikaröntgenstraal van SMT PCBA de Hoge snelheid van de Machineunicomp Gealigneerd met Automobielidentificatie Fabriek

Van de de Elektronikaröntgenstraal van SMT PCBA de Hoge snelheid van de Machineunicomp Gealigneerd met Automobielidentificatie

Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage

Kwaliteit Van de micro- van het de Röntgenstraalsysteem Nadrukelektronika Controle van de Elektronika de Interne Tekorten van SMT Fabriek

Van de micro- van het de Röntgenstraalsysteem Nadrukelektronika Controle van de Elektronika de Interne Tekorten van SMT

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with

Kwaliteit Hoog de Röntgenstraalsysteem van de Vergrotingselektronika voor de Nietige Inspectie van BGA CSP/QFN/PoP Fabriek

Hoog de Röntgenstraalsysteem van de Vergrotingselektronika voor de Nietige Inspectie van BGA CSP/QFN/PoP

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing

Kwaliteit CNC Programmeerbare van de de Röntgenstraalmachine van de Opsporingselektronika de Golfbal Binnenkwaliteitscontrole Fabriek

CNC Programmeerbare van de de Röntgenstraalmachine van de Opsporingselektronika de Golfbal Binnenkwaliteitscontrole

Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and

Kwaliteit Multi - van de de Röntgenstraalmachine van de Functieelektronika de Hoge snelheidsrealtime voor Gouden Bal Fabriek

Multi - van de de Röntgenstraalmachine van de Functieelektronika de Hoge snelheidsrealtime voor Gouden Bal

Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing

Kwaliteit Van de de Inspectieelektronika van PCB BGA de Golfbal van de de Röntgenstraalmachine binnen Kwaliteit het Controleren Fabriek

Van de de Inspectieelektronika van PCB BGA de Golfbal van de de Röntgenstraalmachine binnen Kwaliteit het Controleren

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable

Kwaliteit Hoge snelheids LEIDENE Strook Online ADR X de Detector 130kv van Ray Inspection Equipment FPD Fabriek

Hoge snelheids LEIDENE Strook Online ADR X de Detector 130kv van Ray Inspection Equipment FPD

Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage

Kwaliteit 3.5kW van de LEIDENE Systeem Bar het Gealigneerde X Ray Machine ADR Opsporing voor Binnenkwaliteitscontrole Fabriek

3.5kW van de LEIDENE Systeem Bar het Gealigneerde X Ray Machine ADR Opsporing voor Binnenkwaliteitscontrole

LED bar Inline X-Ray ADR Detection System for Inside Quality Inspection Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage