metal x ray machine
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Hoog nauwkeurige porositeit röntgencomputertomografie machine Unicomp UNCT3200 voor 3D-CT-inspectie van motorbladen
High accuracy porosity X-ray computed tomography machine Unicomp UNCT3200 for engine blades 3D CT inspection Product Description: The UNCT3200 industrial CT testing equipment adopts a robust vertical, double-column architecture resting on a precision-crafted monolithic marble foundation. Equipped with a potent split X-ray tube and a spacious flat panel detector, it adeptly addresses the diverse inspection needs of customers. This multifaceted inspection system boasts an array
UNX6060A van de de Röntgenstraalinspectie van de metaaldetector het Voedsel van het het Systeemsap kleedt Visgraten
UNX6060A X-ray Foreign Materials Detection Equipment Food Safety Inspection Application: Food safety inspection(applicable to all kind of Meat, Fruit, vegetable etc. Inspection for metal particle, Glass chip, ceramic, stone, bone, plastic and other impurity etc. ); Commodity inspection(applicable to bags, shoes, toys, clothing, hardware accessories, electronic components etc.) Features: Easy to operate with mouse and keyboard Hi-accuracy and hi-speed image capture High
De inspectiemachine UNC160 van de Unicomp Industriële Röntgenstraal voor Aluminium het Gieten de barstenndt van de Batterijhuisvesting het controleren
Unicomp Industrial X ray inspection machine UNC160 for Aluminum Die-casting Battery Housing cracks NDT checking System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area
Van de de Elektronikaröntgenstraal van SMT PCBA de Hoge snelheid van de Machineunicomp Gealigneerd met Automobielidentificatie
Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Automatisch de Inspectiesysteem Unicomp 10m Min van de Voedselröntgenstraal met Autoverwerpingsdeel
Unicomp Automatic Food X-Ray Inspection System with auto rejection part, Detection for Metal, Stone Specifications: Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1.5, Glass2.0,Plastic 1.5 Image system Linear detector array Belt Food grade belt, length can be customized Tunnel Size(mm) 600x400 Max.Loading Weight 10kg Monitor 19' Dimension(WxDxH,mm) 1600x790x1800
Voertuig LEIDENE Verlichting X Ray Inspection Machine 0.8kW voor het Solderen Kwaliteit het Controleren
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
CX3000 de Opsporingsmachine van de elektronikapcba Unicomp Röntgenstraal, Benchtop-Röntgenstraalmachine
CX3000 Benchtop Electronics PCBA Unicomp X-ray Detection Equipment Features: 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with high-resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area easily positioned by external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock and emergency button. Applications: BGA , CSP , LED , Flip Chip , Semiconducto
Voedsel en Farmaceutische de Inspectiemachines 1600x790x1800mm van de de Industrieënröntgenstraal
Food X-Ray Detection and Inspection Systems for Foreign Matters Specification : Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1.5, Glass2.0,Plastic 1.5 Image system Linear detector array Belt Food grade belt, length can be customized Tunnel Size(mm) 600x400 Max.Loading Weight 10kg Monitor 19' Dimension(WxDxH,mm) 1600x790x1800 Weight 500kg Safety
