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Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries
Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA Unicomp AX9100max X-ray Machine The AX9100max is a high-performance X-ray inspection system specially designed for IGBT inspection and other advanced ...
Unicomp AX9100max Röntgenmachine 220VAC 50Hz voor Tin Climbing
Unicomp AX9100max röntgenmachine voor tinklimmen De Unicomp AX9100max-röntgenmachine is speciaal ontworpen voor tinklimtoepassingen en biedt geavanceerde inspectiemogelijkheden voor verschillende industrieën. Toepassingsgebieden Breed toegepast voor: BGA, CSP, Flip Chip LED's, fusie, diode PCB, ...
Unicomp AX9100max Röntgenmachine 130kV 65W VAN BGA
Unicomp AX9100max Röntgenmachine 130kV 65W VAN BGA De Unicomp AX9100max-röntgenmachine is ontworpen voor IGBT-inspectie en wordt op grote schaal toegepast in verschillende industrieën, waaronder BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Halve Leider, Batterijindustrie,Kleine metaalgieten, ...
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode ...
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and finds broad application across industries such as BGA/CSP/Flip Chip packaging, LED and optoelectronic component manufacturing, fuse and diode ...
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell The Unicomp AX9100max X-ray Machine is designed for EV Cylindrical Cell inspection and is widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, ...
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing ...
De Röntgenstraalsysteem van AX8200maxunicomp voor Interne Tekortinspectie van Elektronische Componenten
90 kV onderhoudsvrij gesloten buis SMT-röntgenmachine Unicomp AX8200MAX voor BGA LED-oplosgatenmeting Sverlichtingmet een gewicht van niet meer dan 10 kg Systemen samenvatting Voetafdruk 1280 ((W) × 1500 ((D) × 1705 ((H) mm Gewicht van de machine 1400 kg Stroomvoorziening AC 110~220V, 50/60Hz ...
