x ray imaging system
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Industrie Elektronische industrie Röntgeninspectieapparatuur voor draad 1280x1220x1615 mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Large-Scale Inspection Table with Laser Pinpointing for Precise Localization High-Precision
Van de de Röntgenstraalinspectie van elektronikasmt BGA het Systeem130kv CSP LEIDENE AX9100, 1900kg
Electronics SMT BGA X-ray Detection Equipment 130KV CSP LED AX9100 Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● 7 axis linkage, 70 degree tilt detection. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ●
Elektronische PCB-Röntgenstraalmachine met Geïntegreerde Generator, de Keten van de Hoge Resolutieweergave
PCB X Ray Machine with integrated generator, and a high-resolution imaging chain Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60° X-Ray System Tube Type Closed Voltage/Current 100kv/200μA Focal Spot Size 5μm FPD Detector FPD Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm Weight 1500 kg Power 2kW System Magnificat
De hoge Prestaties SMT/EMS-de Röntgenstraalmachine voor de Poreusheid van Metaalafgietsels ontdekken
Metal castings porosity detect X Ray Machine System in Armenia Burma UNC320 is a compact industrial X-ray inspection system designed for broad aerospace and foundry (automotive) applications. Flexible 2D inspection of casting defects and production flaws provide the confidence of a safe and reliable analysis. Compact X-ray system for high-quality, dependable inspection results Manual and programmable X-ray and computed tomography inspection True lnspect ADR (automatic defect
Sponsinkrimping SMT/EMS-de Technologie van Unicomp van de Röntgenstraalmachine voor Versnellingsbaksectie
Gearbox Section Sponge Shrinkage Metal X Ray Detection Machine in Malaysia Unicomp Technology UNC series offer dynamic lines of imaging systems and services for automotive components that detect defects. Safety-critical cast component manufacturers utilize x-ray inspection technology to verify casting integrity. Casting defects such as cavities, gas, inclusion, tearing, foreign material, porosity, shrinkage and sponge are found quickly and objectively using x-ray inspection.
De Machine AX9100 van de hoge Prestatiesröntgenstraal voor het solderen van SMT PTH vullend tarief en de Nietige inspectie van BGA
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
Het toepassen van 5μm dichte buisröntgenstraal om Wearable de knoopcel van het Elektronika navulbare Lithium te inspecteren
Applying 5μm close tube X-ray to inspect Wearable Electronics rechargeable Lithium button cell Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
Het Afgietsel van de aluminiummatrijs SMT/EMS-CNC van de Röntgenstraalmachine Programmeerbare Opsporing voor BGA-Leegten
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
BGA-Materiaal 22 van de Inspectieröntgenstraal“ LCD met CNC Programmeerbare Opsporingsfunctie
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient
