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Kwaliteit CSP BGA X de Gesloten Buis AX8500 van Ray Scanner Machine 100KV FPD Microfocus Fabriek

CSP BGA X de Gesloten Buis AX8500 van Ray Scanner Machine 100KV FPD Microfocus

High resolution FPD with microfocus closed tube AX8500 X-ray system from Unicomp for LED inner bubble and void testing Technical Parameters and Specifications System SummaryFootprint1370(W)×1300(D)×1700(H)mmMachine Weight1600 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size1750(W)×1500(D)×2000(H)mmPacking Weight1800 kgPower Consumption2.0 kWX-Ray TubeTube TypeSealedMax. Power25WVoltage0~110kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (FPD

Kwaliteit Halfgeleider110kv Elektronika X Ray Machine 5um AX8500 voor PCBA BGA Fabriek

Halfgeleider110kv Elektronika X Ray Machine 5um AX8500 voor PCBA BGA

110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Kwaliteit Unicompax8500 X Ray Inspection Machine For SMT EMS BGA het LEIDENE Solderen van CSP QFN Fabriek

Unicompax8500 X Ray Inspection Machine For SMT EMS BGA het LEIDENE Solderen van CSP QFN

Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement​ Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Kwaliteit 5um SMT X Ray Equipment CNC Programmeerbaar voor de Leegten van EMS BGA Fabriek

5um SMT X Ray Equipment CNC Programmeerbaar voor de Leegten van EMS BGA

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Kwaliteit Elektronika X Ray Machine 110kV Unicomp AX8500 van CSP SMT voor SMT PCBA BGA QFN Fabriek

Elektronika X Ray Machine 110kV Unicomp AX8500 van CSP SMT voor SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

Kwaliteit CSP-Spaander AX8500 de HOOFD X van Ray Machine Closed Tube Flip voor 100KV-Halfgeleider Fabriek

CSP-Spaander AX8500 de HOOFD X van Ray Machine Closed Tube Flip voor 100KV-Halfgeleider

Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Kwaliteit Elektronika X de Vergroting Unicomp AX8500 van SMT BGA van Ray Machine FPD 1000X Fabriek

Elektronika X de Vergroting Unicomp AX8500 van SMT BGA van Ray Machine FPD 1000X

Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel

Kwaliteit Elektronika X van PCB van EMS SMT LEIDENE van Ray Machine BGA QFN Solderend Nietig NDT Inspectiemateriaal Fabriek

Elektronika X van PCB van EMS SMT LEIDENE van Ray Machine BGA QFN Solderend Nietig NDT Inspectiemateriaal

Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Application Fields of X Ray Machine AX8200Max SMT/PCBA Inspection Semiconductor Inspection Lithium Batteries Inspection LED Inspection Photovoltaic

Kwaliteit 130KV Microfocus Röntgenbron voor Lithium Batterij Interne Defectdetectie Fabriek

130KV Microfocus Röntgenbron voor Lithium Batterij Interne Defectdetectie

Unicomp 130kV Microfocus X Ray Source For EMS SMT PCBA BGA QFN X Ray Machine UNMS-U130B is a closed tube 130 kV Microfocus X-Ray Source using hot cathode technology, digital control and 100% domestic raw materials. It has the advantages of small focal spot size, high magnification, stable X-Ray emission, higher output power and strong penetration ability. The high voltage, control circuit and cooling unit are properly arranged within a compact space, with 24V DC power supply