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x ray inspection equipment

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Kwaliteit Hoge de Röntgenstraalmachine van Automatiseringsbga voor Droge Gezamenlijke Opsporing en Analyse Fabriek

Hoge de Röntgenstraalmachine van Automatiseringsbga voor Droge Gezamenlijke Opsporing en Analyse

Dry joint detection and analysis BGA X-Ray Inspection Machine​ X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. ( Offline X - Ray series ) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm

Kwaliteit De Röntgenstraalmachine van de hoge Resolutieelektronika, IC-van LEIDENE de Detector Klemmen Elektronische Componenten Fabriek

De Röntgenstraalmachine van de hoge Resolutieelektronika, IC-van LEIDENE de Detector Klemmen Elektronische Componenten

IC LED Clips Electronic Components Detector Electronics X Ray Machine X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray. (2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB

Kwaliteit 100KV X Ray Flaw Inspection Machine High-Efficiency 2kW voor LEIDENE Verlichting Fabriek

100KV X Ray Flaw Inspection Machine High-Efficiency 2kW voor LEIDENE Verlichting

Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Modular design with In-line expansibility. ● Economical and Practical. ● 100KV 5μm X-Ray tube. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. ● Real-time image. ● 1000X system magnification. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta

Kwaliteit De inspectiemachine UNC160 van de Unicomp Industriële Röntgenstraal voor Aluminium het Gieten de barstenndt van de Batterijhuisvesting het controleren Fabriek

De inspectiemachine UNC160 van de Unicomp Industriële Röntgenstraal voor Aluminium het Gieten de barstenndt van de Batterijhuisvesting het controleren

Unicomp Industrial X ray inspection machine UNC160 for Aluminum Die-casting Battery Housing cracks NDT checking System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area

Kwaliteit De Machine van de de Elektronikaröntgenstraal van het Smtmateriaal, PCB-de Micro BGA van het Inspectiesysteem bij de Karbonadeanalyse Fabriek

De Machine van de de Elektronikaröntgenstraal van het Smtmateriaal, PCB-de Micro BGA van het Inspectiesysteem bij de Karbonadeanalyse

PCB X Ray Machine high quality PCB inspection system Micro BGA on chop analysis Our unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X -

Kwaliteit BGA QFN CSP X Ray Equipment LX2000 CNC Programmeerbaar voor het Solderen van FPC SMT Fabriek

BGA QFN CSP X Ray Equipment LX2000 CNC Programmeerbaar voor het Solderen van FPC SMT

LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed

Kwaliteit 5um hoge Resolutie X de Fabriek van Ray Equipment For Electric Switch Unicomp Productie Fabriek

5um hoge Resolutie X de Fabriek van Ray Equipment For Electric Switch Unicomp Productie

Unicomp Factory Manufacturing 5μm High Resolution X-ray Equipment for Electric Switch Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5μm/15μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm

Kwaliteit 0.5kW multifunctionele Elektronika X Ray Machine For Electricity Products Fabriek

0.5kW multifunctionele Elektronika X Ray Machine For Electricity Products

0.5kW Multifunctional Electronics X Ray Machine For Electricity Products Multifunctional compact size X-ray Inspection System for electricity products&small casting parts quality checking Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm

Kwaliteit De Röntgenstraalmateriaal 220AC/50Hz van kabinetsunicomp met DXI-het Systeem van de Beeldverwerking Fabriek

De Röntgenstraalmateriaal 220AC/50Hz van kabinetsunicomp met DXI-het Systeem van de Beeldverwerking

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework