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Kwaliteit Aluminiumndt de Machine Ruimtevaart Automobieldelen UNC130 van de Röntgenstraalopsporing Fabriek

Aluminiumndt de Machine Ruimtevaart Automobieldelen UNC130 van de Röntgenstraalopsporing

Aluminum NDT X ray Detection Machine Aerospace Automotive Parts UNC130 Features: ● 130kV,20μm X-ray tube, FPD; ● Multi-function workstation with 360°"ARC" motion and shift; ● C-arm fixture design enabling five-axis motion detection(Auto lift and descend); ● User friendly software design for easy interfacing can facilitate,customized software; ● Max. detection area Φ300*500mm. Applications: ● Precise casting parts and parts for Automobile ● Crop,Ceramics and Metal parts ●
Kwaliteit 3D X Ray Offline CT-inspectiesysteem Unicomp AX9500 voor inspectie van PCB-lagen Fabriek

3D X Ray Offline CT-inspectiesysteem Unicomp AX9500 voor inspectie van PCB-lagen

3D X-Ray computed temography offline CT Inspection system unicomp AX9500 for PCB layers inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum die-casting
Kwaliteit Hoge precisie UNICOMP X Ray CT-machine AX9500 voor nauwkeurige PCB / BGA-inspectie Fabriek

Hoge precisie UNICOMP X Ray CT-machine AX9500 voor nauwkeurige PCB / BGA-inspectie

High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum
Kwaliteit Van het de Opsporingsmateriaal van Unicomp Buitenlandse Materialen van het de Röntgenstraalsysteem de Voedselveiligheidgoederen Fabriek

Van het de Opsporingsmateriaal van Unicomp Buitenlandse Materialen van het de Röntgenstraalsysteem de Voedselveiligheidgoederen

Unicomp X-ray Foreign Materials Detection Equipment Food Safety Commodity Application: Food safety inspection(applicable to all kind of Meat, Fruit, vegetable etc. Inspection for metal particle,Glass chip, ceramic, stone, bone, plastic and other impurity etc. ); Commodity inspection(applicable to bags, shoes, toys, clothing, hardware accessories, electronic components etc.). Features: Easy to operate with mouse and keyboard Hi-accuracy and hi-speed image capture High
Kwaliteit Systeem van de de Röntgenstraal Tegenopsporing van de hoge Resolutiesmd Spaander Één Knoopverrichting Fabriek

Systeem van de de Röntgenstraal Tegenopsporing van de hoge Resolutiesmd Spaander Één Knoopverrichting

SMD Chip Electronic Component Unicomp X ray Counter Inspection System This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the classifica
Kwaliteit Van het Kabinetsunicomp van elektronikasmt van de de Röntgenstraalinspectie de Analyse van de het Systeemax8500 Mislukking Fabriek

Van het Kabinetsunicomp van elektronikasmt van de de Röntgenstraalinspectie de Analyse van de het Systeemax8500 Mislukking

Electronics SMT Cabinet Unicomp X-Ray Inspection System AX8500 Failure Analysis Features: ● 100KV 5μm X-Ray tube. ● FPD Detector. ● Real-time image. ● 1000X system magnification. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. ● Modular design with In-line expansibility. ● Economical and Practical. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
Kwaliteit Voedsel X-ray inspectie systeem voor het controleren van vreemde stoffen in verpakte levensmiddelen Fabriek

Voedsel X-ray inspectie systeem voor het controleren van vreemde stoffen in verpakte levensmiddelen

FOOD X-RAY Inspection System APPLICATION UNX6030-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. FEATURES Easy to Operate: one button start&stop, optional default product Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass,
Kwaliteit Unicomp LX9200 3D CT X Ray Computed Temography Machine 130KV Inline voor PCB BGA-inspectie Fabriek

Unicomp LX9200 3D CT X Ray Computed Temography Machine 130KV Inline voor PCB BGA-inspectie

Unicomp high quality 130KV inline Unicomp LX9200 3D CT X-Ray computed temography machine for PCB BGA inspection Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge...
Kwaliteit Hoge penetratie Inline 3D CT Machine X Ray Machine voor PCB-testen Unicomp LX9200 Fabriek

Hoge penetratie Inline 3D CT Machine X Ray Machine voor PCB-testen Unicomp LX9200

High penetration inline 3D CT machine X-Ray machine for PCB testing Unicomp LX9200 with real-time display Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type:BGA,LGA,CSP,POP,SIP... Defect type:Void,HIP,Insufficient,Bridge... Semiconductor