Unicompröntgenstraal
De dichte Röntgenstraal AX9100 130kV van Buisunicomp voor Elektronikacomponenten
130kV close tube X-ray Equipment AX9100 with high resolution FPD for electronics components couterfeit inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum ...
IC-Halfgeleider Unicomp X Ray High Magnification Microfocus AX9100 130KV
Directly factory supply of microfocus X Ray System AX9100 with high magnification for IC Semiconductor Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum ...
De Röntgenstraal 130kV AX9100 van Elektronische industrieunicomp voor het LEIDENE van SMT PCBA Solderen
Unicomp factory supply 130kV microfocus AX9100 X-ray for SMT PCBA LED soldering void automatic measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die...
1.2kW elektronica röntgenmachine 130kV AX9100 voor SMT LED QFN soldeer leegte
130kV Microfocus AX9100 X Ray For SMT LED QFN soldering void automatic mapping and measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, ...
de Röntgenstraal AX9100 van 130kV Microfocus Unicomp voor SMT-de LEIDENE Leegtenmeting van BGA QFN
130kV Microfocus X Ray Inspection Machine Unicomp AX9100 For SMT LED BGA QFN Voids measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, ...
7um gesloten buis 1,2 kW röntgenmachine voor SMT BGA CSP
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 44.7X Geometric magnification, high-definition real-time image. ● One-button operation with 2...
Microfocus gesloten buis Unicomp X Ray 130kV 7um voor SMT BGA-solderen
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● ...
Unicomp Microfocus röntgeninspectiesysteem 130kV 7um voor FPD-afbeelding
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● ...
BGA QFN Unicomp X Ray Inspection System 130KV met 6 Asbeweging
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1280(L)x1510(W)x1700(H)mm Weight 1750kg Power 220AC/50Hz Power Consumption 1.2kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 65W ...
