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Kwaliteit Hoge snelheids LEIDENE Strook Online ADR X de Detector 130kv van Ray Inspection Equipment FPD Fabriek

Hoge snelheids LEIDENE Strook Online ADR X de Detector 130kv van Ray Inspection Equipment FPD

Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage

Kwaliteit 130kV 5μm X Ray Inspection Equipment For 1.2m LEIDENE Lichten Fabriek

130kV 5μm X Ray Inspection Equipment For 1.2m LEIDENE Lichten

Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification

Kwaliteit EMS-het Systeem van de de Röntgenstraalmachine van de Halfgeleiderelektronika voor de inspectie van BGA en CSP- Fabriek

EMS-het Systeem van de de Röntgenstraalmachine van de Halfgeleiderelektronika voor de inspectie van BGA en CSP-

EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

Kwaliteit SMT BGA X de Detector 130KV van Ray Detection Equipment Flip Chip FPD voor Semicon Fabriek

SMT BGA X de Detector 130KV van Ray Detection Equipment Flip Chip FPD voor Semicon

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image

Kwaliteit BGA-Materiaal 22 van de Inspectieröntgenstraal“ LCD met CNC Programmeerbare Opsporingsfunctie Fabriek

BGA-Materiaal 22 van de Inspectieröntgenstraal“ LCD met CNC Programmeerbare Opsporingsfunctie

Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient

Kwaliteit Van de de Inspectieelektronika van PCB BGA de Golfbal van de de Röntgenstraalmachine binnen Kwaliteit het Controleren Fabriek

Van de de Inspectieelektronika van PCB BGA de Golfbal van de de Röntgenstraalmachine binnen Kwaliteit het Controleren

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable

Kwaliteit 22“ LCD het Solderen van Monitorsmt EMS het Materiaal Hoge Resolutie van de Tekorten Elektronische Inspectie Fabriek

22“ LCD het Solderen van Monitorsmt EMS het Materiaal Hoge Resolutie van de Tekorten Elektronische Inspectie

Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,

Kwaliteit Online de Machinekabinet van de Elektronikaröntgenstraal, het Systeemcnc van de Röntgenstraalinspectie Motiewijze Fabriek

Online de Machinekabinet van de Elektronikaröntgenstraal, het Systeemcnc van de Röntgenstraalinspectie Motiewijze

Online Electronics X Ray Machine Cabinet X-Ray Inspection System The LX-2000 is a versatile OnLine X-ray Machine designed for automated and semi-automated analysis. In addition to the OnLine capability, the LX-2000 can also be used in a Manual mode as a process monitoring/engineering workstation. High resolution x-ray images are generated using a closed microfocus 130kV tube with leading edge FPD (Flat Panel Display) detectors. This imaging chain combination is excellent for

Kwaliteit EMS-van de de Röntgenstraalinspectie van Halfgeleiderunicomp de Machineelektronika BGA AX8200 Fabriek

EMS-van de de Röntgenstraalinspectie van Halfgeleiderunicomp de Machineelektronika BGA AX8200

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework