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Kwaliteit Unicomp AX8200max röntgeninspectiemachine voor inspectie van kabelboomdefecten Fabriek

Unicomp AX8200max röntgeninspectiemachine voor inspectie van kabelboomdefecten

Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace ...

Kwaliteit 1uSv/H lithiumbatterij X de Afbeelding van Ray Inspection Equipment BGA CNC Fabriek

1uSv/H lithiumbatterij X de Afbeelding van Ray Inspection Equipment BGA CNC

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200B The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes ...

Kwaliteit Unicomp AX8200 100KV X Ray Scanning Machine For BGA CSP Fabriek

Unicomp AX8200 100KV X Ray Scanning Machine For BGA CSP

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” ...

Kwaliteit Vervalste Inspectie EMS BGA X Ray Machine For Electronics Components Fabriek

Vervalste Inspectie EMS BGA X Ray Machine For Electronics Components

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV/100kV Max.Power 8W Spot Size 5μm X-ray System Intensifier ...

Kwaliteit IC BGA CSP Inspectie van verpakkingsdefecten X-ray AX8300 UNICOMP Volledig CNC automatisch scannen Fabriek

IC BGA CSP Inspectie van verpakkingsdefecten X-ray AX8300 UNICOMP Volledig CNC automatisch scannen

IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...

Kwaliteit CSP X Ray Inspection Machine 90kV voor Zonnecel het Solderen Fabriek

CSP X Ray Inspection Machine 90kV voor Zonnecel het Solderen

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes ...

Kwaliteit Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis Fabriek

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...

Kwaliteit Superresolutie röntgeninspectieafbeelding van het inspecteren van de binnenkant van de antenne met ons populaire verkoopmodel AX7900 Fabriek

Superresolutie röntgeninspectieafbeelding van het inspecteren van de binnenkant van de antenne met ons populaire verkoopmodel AX7900

AX7900 Super Resolution X-Ray Inspection System for Antenna Internal Inspection The UNICOMP AX7900 X-Ray Inspection System delivers superior resolution imaging for comprehensive internal inspection of antenna components and other electronic assemblies. System Overview Equipped with a 90kV/5μm ...

Kwaliteit SMT BGA X de Detector 130KV van Ray Detection Equipment Flip Chip FPD voor Semicon Fabriek

SMT BGA X de Detector 130KV van Ray Detection Equipment Flip Chip FPD voor Semicon

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high ...

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