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Kwaliteit 3µM Microfocus Tube X Ray Machine AX9100 voor CSP EMS BGA Fabriek

3µM Microfocus Tube X Ray Machine AX9100 voor CSP EMS BGA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Kwaliteit Elektronika X van PCB van EMS SMT LEIDENE van Ray Machine BGA QFN Solderend Nietig NDT Inspectiemateriaal Fabriek

Elektronika X van PCB van EMS SMT LEIDENE van Ray Machine BGA QFN Solderend Nietig NDT Inspectiemateriaal

Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Application Fields of X Ray Machine AX8200Max SMT/PCBA Inspection Semiconductor Inspection Lithium Batteries Inspection LED Inspection Photovoltaic

Kwaliteit AX8200max pcb-röntgenmachine 90kV met kantelfunctie ±60° voor inspectie Fabriek

AX8200max pcb-röntgenmachine 90kV met kantelfunctie ±60° voor inspectie

90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Application Fields of SMT X-Ray machine Unicomp AX8200MAX BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, Other Special Industries. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive

Kwaliteit De off-line meting van AX8200Max SMT EMS X Ray Machine Auto Mapping Fabriek

De off-line meting van AX8200Max SMT EMS X Ray Machine Auto Mapping

Offline AX8200Max SMT EMS X Ray Machine Auto Mapping Measurement Unicomp offline AX8200Max X-ray with auto-mapping and measurement for BGA QFN LED soldering Void Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot

Kwaliteit AX7900 Unicomp X Ray Machine IC Chip Kwaliteitscontrole X Ray Inspectieapparatuur Fabriek

AX7900 Unicomp X Ray Machine IC Chip Kwaliteitscontrole X Ray Inspectieapparatuur

IC Chip Quality Check with Unicomp AX7900 X Ray Inspection Equipment Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area

Kwaliteit Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array Fabriek

Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array

Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application fields

Kwaliteit Gesloten Buiselektronika X Ray Machine AX8200B 100kv voor Groeperingsinspectie Fabriek

Gesloten Buiselektronika X Ray Machine AX8200B 100kv voor Groeperingsinspectie

Digital Real Time AX8200B X Ray Machine for diamond core drill bit inner layer alignment inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process

Kwaliteit AX8200B Unicomp X de Programmeerbare Inspectie van Ray Machine CNC voor Cilindrische Lithiumbatterij Fabriek

AX8200B Unicomp X de Programmeerbare Inspectie van Ray Machine CNC voor Cilindrische Lithiumbatterij

AX8200B X-Ray machine for cylindrical lithium battery CNC programmable inspection with auto measurement Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X

Kwaliteit AX8200max Elektronische röntgenmachine met 6 assen 360 graden rotatie Fabriek

AX8200max Elektronische röntgenmachine met 6 assen 360 graden rotatie

Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector