industrial inspection systems
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Unicomp UNX6030N Zware lading röntgenlicht voedsel inspectie machine voor soja-melkpoeder in IP66 waterdicht niveau
Unicomp UNX6030N heavy load X ray food inspection machine for soybean milk powder in IP66 waterproof level APPLICATION The UNX6030-N is employed for detecting contaminants in the form of foreign matter within small packages containing lightweight products, including candies, fresh meat, prawns, vegetables, poultry, chocolates, pastries, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, and more. FEATURES Easy to Operate: one button start&stop,
Hoge specificaties Elektronische boards 2D & 2.5D Röntgenmachine Unicomp AX9100MAX Met 360 graden rotatietafel Voor BGA En PCB-inspectie
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
SMT-PCB-röntgenmachine met hoge resolutie Micron Focus Spot Grootte Unicomp AX7900 Voor kwaliteits- en scheurinspectie van de binnenkant van de mobiele telefoon
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray
Unicomp UNC160 NDT X-Ray Inspection Equipment For Car Parts
Unicomp UNC160 NDT X-Ray Inspection Equipment For Car Parts Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard,
Unicomp UNC160 NDT X-Ray Inspection Equipment For Automotive Hardware
Unicomp UNC160 NDT X-Ray Inspection Equipment For Automotive Hardware Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Broad Application Scope: Supports large-scale inspections with high load-bearing capacity. Safety Compliance: Adheres to international
Unicomp UNC160 NDT-röntgeninspectieapparatuur voor autocomponenten
Unicomp UNC160 NDT X-Ray Inspection Equipment For Car Components Product Description Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Broad Application Scope: Supports large-scale inspections with high load-bearing capacity. Safety Compliance: Adheres to
EMS-het Systeem van de de Röntgenstraalmachine van de Halfgeleiderelektronika voor de inspectie van BGA en CSP-
EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Motherboard het Systeem van de de Röntgenstraalinspectie van Bga met Buitengewoon breed Inspectiegebied
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
110LP/CM 120kV X Ray Inspection Equipment For 18650 Lithium
Application Inline X-Ray inspection machine for Cylinder Lithium Batteries, 18650, 26650, etc. Features • 120kV 5µm closed X-Ray tube, 4” image intensifier (FPD for option) detector • Inline conveyor system with high speed and steady transferring capability • Unicomp self-developed X-Ray inspection software, free upgrading in the whole life time • Auto-sorting for the OK and NG parts and transferring to different conveyor system • Special customized design for cylinder
