industrial inspection systems
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Unicomp UNC160 NDT X-Ray Inspection Equipment For Car Parts
Unicomp UNC160 NDT X-Ray Inspection Equipment For Car Parts Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard,
Unicomp UNC160 NDT X-Ray Inspection Equipment For Automotive Hardware
Unicomp UNC160 NDT X-Ray Inspection Equipment For Automotive Hardware Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Broad Application Scope: Supports large-scale inspections with high load-bearing capacity. Safety Compliance: Adheres to international
Unicomp UNC160 NDT-röntgeninspectieapparatuur voor autocomponenten
Unicomp UNC160 NDT X-Ray Inspection Equipment For Car Components Product Description Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Broad Application Scope: Supports large-scale inspections with high load-bearing capacity. Safety Compliance: Adheres to
EMS-het Systeem van de de Röntgenstraalmachine van de Halfgeleiderelektronika voor de inspectie van BGA en CSP-
EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Motherboard het Systeem van de de Röntgenstraalinspectie van Bga met Buitengewoon breed Inspectiegebied
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
110LP/CM 120kV X Ray Inspection Equipment For 18650 Lithium
Application Inline X-Ray inspection machine for Cylinder Lithium Batteries, 18650, 26650, etc. Features • 120kV 5µm closed X-Ray tube, 4” image intensifier (FPD for option) detector • Inline conveyor system with high speed and steady transferring capability • Unicomp self-developed X-Ray inspection software, free upgrading in the whole life time • Auto-sorting for the OK and NG parts and transferring to different conveyor system • Special customized design for cylinder
Lithiumbatterij 0.45mA 110kV X Ray Inspection Equipment 4.0kW
Features • Special customized design for cylinder lithium batteries, 18650, 26650, etc. • Easy installation and user friendly • 120kV 5µm closed X-Ray tube, 4” image intensifier (FPD for option) detector • Inline conveyor system with high speed and steady transferring capability • Unicomp self-developed X-Ray inspection software, free upgrading in the whole life time • Auto-sorting for the OK and NG parts and transferring to different conveyor system Item Description
Van de de Weerstands het elektronische inspectie van SMT Chipset materiaal AX8200 Röntgenstraal Gesloten 5g
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Inspectie X Ray Chip Counter 440mm van SMT BGA Tunnelce
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
